Xpedition Enterprise VX.2 Win/Linux 注册版 - PCB电子设计与仿真全流程解决方案

Mentor Graphics公司Xpedition Enterprise企业级电子设计平台为设计者提供了一个从概念设计到生产制造的全流程解决方案。它涉及到PCB设计的所有方面，从系统定义、原理仿真、约束定义、Layout，到后续生产制造的DFM分析、PCB装配的数据打包等，都在设计平台中得以完美实现。

Mentor Graphics的Xpedition Enterprise企业级电子设计平台可以为用户提供PCB电子设计与仿真的全流程解决方案。在横向上要求各部门和各设计人员通力合作，纵向上要求设计各个阶段综合考虑，把设计和仿真贯穿于整个设计过程，实现过程的可控性，具体指标的量化，降低设计开发周期，提高设计效率，提高产品质量。

Mentor Graphics 非常高兴地宣布，我们为 Xpedition Enterprise 推出了 VX 版。这是激发下一代成熟的、创新的 PCB 设计思想的基础。本系列网络研讨会将为您介绍我们最新版本中采用的技术。

套件包括：

Xpedition Enterprise Flow – X-ENTP VX.2 for Linux 32bit
Xpedition Enterprise Flow – X-ENTP VX.2 for Linux 64bit
Mentor xDM 3D Libray for Linux 64bit
Xpedition Enterprise Flow (Documentation) X-ENTP VX.2 for Linux

Xpedition Enterprise Flow xSC System Cable
Xpedition Enterprise Flow – X-ENTP VX.2 for Windows 32bit
Xpedition Enterprise Flow – X-ENTP VX.2 for Windows 64bit
Mentor xDM 3D Library for Windows 64bit
Xpedition Enterprise Flow (Documentation) X-ENTP VX.2 for Windows
Xpedition XENTP Library Rev.1a

Mentor Graphics Corporation announced the first phase of the new Xpedition printed circuit design (PCB) flow to address the increasing complexity of today’s advanced systems designs. The increasing densities of electronics products are forcing companies to develop highly compact system designs with more functionality, and at lower costs. To efficiently manage the density and performance requirements for advanced PCB systems, the new Xpedition flow provides advanced technologies to enable design and verification of 3D rigid-flex structures, and to automate layout of high-speed topologies with advanced constraints.

Managing Advanced Rigid Flex Design Complexity

Flex and rigid-flex PCBs are now found in all types of electronics products, from small consumer devices to aerospace, defense and automotive electronics where high reliability and safety are critical. The Xpedition rigid-flex technology enables a streamlined design process from initial stack-up creation through manufacturing.

Engineers can design complex rigid and flex PCBs in a fully supported 3D environment (3D design and verification—not just a 3D view), resulting in a correct-by-construction methodology for optimum reliability and product quality. 3D verification ensures that bends are in the right position, and elements on the board do not interfere with folding; this can be reviewed early in the design stage to prevent costly redesigns. Users can then export a 3D solid model to MCAD for efficient bi-directional PCB-enclosure co-design.

Integration with Mentor’s leading HyperLynx® high-speed analysis technology enables optimization of signal and power integrity across complex rigid-flex stack-up structures. For fabrication preparation, the Xpedition flow provides all flex and rigid information using the ODB++ common data format. This methodology eliminates data ambiguities by clearly communicating the finished board intent to the fabricator. The new Xpedition flow is the optimum solution designed specifically for flex and rigid-flex design, from conception through fabrication output.

For efficient rigid-flex development, key features and capabilities include:

– Definition of the rigid-flex stack-up with unique outlines for each region, enabling simpler design changes than stack-up by zone. Standard flex materials (e.g. laminates, ’embedded’ or ‘bikini’ cover layers, stiffeners, adhesives, etc.) can be included in the stack-up.
– Full support of flex bends to manage where and how the PCB bends, including parts placement on flex layers, flex routing, plane shape fills, tear drops and trace drops. Once bends are defined, the design can be viewed and validated in 3D to ensure there are no collisions.
– Powerful user interface with intuitive and simple selection controls to properly manage the design.
– Electrical rule checking (ERC) using a customizable local rules checker and a comprehensive set of post-design checks for first-pass success.
– Flex-aware signal and power integrity analysis, enabling accurate modeling of interconnect as it passes through different stack-up regions.
– Design for manufacturing (DFM) validation and new product introduction (NPI) tools to ensure seamless PCB design to fabrication management and efficiency.

Automated Layout for High-Speed Designs

The new Xpedition release also features advanced layout automation to address increasing complexity in high-speed designs and emerging guidelines for high-end computing chip-sets. The following key functionality helps optimize designs for performance:

– Tabbed routing, an interconnect geometry used to minimize crosstalk and impedance discontinuities, can be created and modified on high-speed traces.
– Designers can create and modify a routing strategy with sketch plans that define a path for trunks of nets, including trace shielding.
– Enhanced tuning enables better feedback and control during interactive editing to achieve high-speed constraints.
– Nets which require back drilling can be defined in layout and output for manufacturing.
– Engineers can import Polar stack-ups and layer mapping directly into the constraint manager to simplify design start-up.
– A new user interface enables review of all design rule checks in the design for quick identification and resolution of electrical and manufacturing design violations.

Included:
Xpedition Enterprise Flow – X-ENTP VX.2 for Linux 32bit
Xpedition Enterprise Flow – X-ENTP VX.2 for Linux 64bit
Mentor xDM 3D Libray for Linux 64bit
Xpedition Enterprise Flow (Documentation) X-ENTP VX.2 for LinuxXpedition Enterprise Flow xSC System Cable
Xpedition Enterprise Flow – X-ENTP VX.2 for Windows 32bit
Xpedition Enterprise Flow – X-ENTP VX.2 for Windows 64bit
Mentor xDM 3D Library for Windows 64bit
Xpedition Enterprise Flow (Documentation) X-ENTP VX.2 for Windows
Xpedition XENTP Library Rev.1a
Name: Mentor Graphics Xpedition Enterprise
Version: VX.2 with Documentation and Library
Supported Architectures: 32bit / 64bit

Mentor Graphics Xpedition Enterprise VX.2 Win/Linux 注册版下载地址：